Questions & Answers

Some common questions we get about Titanium Fingers Limited

  • Company Background

    1. Where are We Located?

    Titanium Fingers Limited are Located in Wales, United Kingdom. Our Company Registered Address : Titanium Fingers Limited, Unit 15b Stradey Park, Building 52 Business Centre, Llangennech, SA14 8YP, Wales, United Kingdom.

    2. What Can We Do?

    With over 40 years of experience and expertise in the engineering and manufacturing industries, we have established a customer base both in the UK and worldwide. We offer a comprehensive range of titanium products and services, particularly for the printed circuit board soldering process industry and the food industry. Our clients include renowned companies such as Sony, TT Electronics, Axiom, TMI (France, Turkey), and CIDP (Poland, Italy, Spain).

    Our fabrication welding and general engineering department specializes in the manufacture and fitting of various products. We excel in working with stainless steel, aluminium, mild steel, copper, and titanium machining and fabrication.

    The strength of our company lies in our ability to design, prototype, and supply the finest quality products at the most competitive prices in the market. We pride ourselves on our speedy response and our capability to innovate and problem-solve.

    3. What Languages Can We Support?

    We do have, as part of our extencive team, the ability to speak many languages, some fluent others basic level. English, Welsh, Italian, Greek, German, South African, Portuguese. We also have access to translation apps and online support.

  • Why Use Titanium Material for Fingers

    Titanium fingers are considered ideal for wave soldering machines due to their unique combination of properties that are particularly suited for the high-temperature and corrosive environment of wave soldering. Here’s why:

    1. High-Temperature Resistance

    Wave soldering involves molten solder at temperatures ranging from 230°C to 260°C (446°F to 500°F). Titanium can withstand these temperatures without deforming or losing its mechanical properties, making it highly reliable in this application.

    2. Corrosion Resistance

    Molten solder is highly corrosive, and the flux used in the soldering process can also be chemically aggressive. Titanium has exceptional resistance to corrosion from solder alloys, flux, and other chemicals used in the process, ensuring durability and long life.

    3. Strength-to-Weight Ratio

    Titanium is both strong and lightweight, which makes it easy to handle and install in wave soldering machines while maintaining structural integrity over repeated use.

    4. Non-Reactivity with Solder

    Titanium does not react with or contaminate the solder, maintaining the purity of the solder and the quality of the soldered joints. This is crucial for ensuring consistent results and avoiding defects.

    5. Long Service Life

    Due to its durability and resistance to wear and tear, titanium fingers last significantly longer than alternatives like stainless steel, reducing downtime and maintenance costs.

    6. Precision

    Titanium can be machined into precise shapes and dimensions required for guiding PCBs (printed circuit boards) through the solder wave, ensuring accurate and consistent alignment during the soldering process.

    7. Cost Effectiveness Over Time

    Although the initial cost of titanium is higher than other materials, its longevity and low maintenance needs make it more cost-effective in the long run.

    8. Conclusion

    Titanium fingers provide unmatched performance in wave soldering due to their ability to endure harsh environments, maintain precision, and reduce maintenance, making them the top choice for this application.

  • Wave Solder Machine Best Practices

    Wave soldering is a key process in the manufacture of printed circuit boards (PCBs), ensuring efficient solder joint formation for through-hole and mixed-technology assemblies. To maximize efficiency, minimize defects, and maintain consistent quality, follow these best practices:

    1. Preparation and Setup

    PCB Design for Wave Soldering:

    • Ensure proper pad and hole sizes to prevent insufficient or excessive solder.

    • Maintain a clear solder mask to reduce bridging and shorts.

    • Position components to minimize shadowing and optimize solder flow.

    Flux Selection and Application:

    • Choose the appropriate flux (rosin-based, water-soluble, or no-clean) based on your application.

    • Use a fluxer to apply an even, consistent coating of flux.

    • Regularly calibrate and maintain the flux application system to avoid over- or under-fluxing.

    Preheat Settings:

    • Adjust preheat zones to ensure proper flux activation and minimize thermal shock to PCBs.

    • Monitor preheat temperatures with thermocouples or infrared sensors.

    2. Wave Solder Parameters

    Solder Pot Temperature:

    • Maintain solder pot temperatures between 245°C and 265°C for lead-free solder and between 235°C and 255°C for leaded solder.

    • Regularly check and calibrate the solder pot to avoid temperature fluctuations.

    Conveyor Speed:

    • Set the conveyor speed to optimize contact time with the solder wave, typically between 3 and 7 seconds.

    Wave Height and Flow:

    • Adjust the wave height to ensure proper coverage of solder on the leads and pads.

    • Use a smooth laminar flow to reduce turbulence and solder splashes.

    3. Component and Material Considerations

    Component Orientation:

    • Place tall components upstream to reduce shadowing and ensure even solder coverage.

    • Orient through-hole leads perpendicular to the wave direction to improve solder wicking.

    Material Quality:

    • Use high-purity solder to reduce dross formation and contamination.

    • Regularly monitor and replenish solder levels in the pot.

    4. Defect Prevention and Troubleshooting

    Common Defects and Solutions:

    • Bridging: Check flux application, reduce solder temperature, and ensure proper component spacing.

    Insufficient Solder:

    • Increase solder wave height or slow the conveyor speed.

    Solder Balls:

    • Optimize preheat settings and flux activation to remove moisture.

    Dross Management:

    • Skim dross from the solder pot regularly to maintain solder quality.

    • Use anti-dross agents or nitrogen blanketing if applicable.

    5. Maintenance and Calibration

    Daily Maintenance:

    • Clean the solder pot, wave nozzles, and fluxer.

    • Check for clogged or damaged nozzles.

    Periodic Calibration:

    • Verify conveyor speed, wave height, and solder pot temperature.

    • Inspect and replace worn parts, such as pumps and heaters.

    Documentation:

    • Keep detailed records of machine settings, maintenance, and production runs to identify trends and improve processes.

    6. Safety Practices

    • Provide proper ventilation to minimize exposure to solder fumes and flux residues.

    • Equip operators with appropriate personal protective equipment (PPE), including gloves, safety glasses, and heat-resistant clothing.

    • Train staff on emergency procedures for handling molten solder spills or equipment malfunctions.

    7. Environmental Considerations

    • Dispose of waste materials, including used flux and dross, according to environmental regulations.

    • Explore energy-efficient soldering machines and lead-free solder options to reduce environmental impact.

    By adhering to these best practices, manufacturers can achieve reliable soldering results, reduce defects, and prolong the life of wave solder equipment.:

  • Solder Analysis

    1. Why do Solder Analysis?

    Solder baths or dipping pots can very easily become contaminated in numerous ways including.

    • The solder could already include a high level of impurities when received, especially if the solder has been remanufactured using recycled materials.

    • May be contaminated over a period of time during continual use by copper leaching from the processed PCBs.

    • Contamination nickel from components or support tooling.

    Several contaminants such as Silver and Bismuth are not specifically detrimental in small quantities, therefore are very much only an indication of the purity of the solder. However, elements such as Aluminium, Cadmium and Zinc are potentially detrimental to the general performance of the alloy in the bath. Non-metallic impurities such as Sulphur and Phosphorous will affect the solder in as much as they can cause de-wetting conditions.

    The table below highlights some of the common contaminants found today in solder baths and gives a brief description as to how they can affect solderability, dross creation, joint formation, and in general wetting ability.

    Lement : Aluminium

    Contamination Affects

    Very low levels down to 0.005% may increase the rate of dross production but without necessarily affecting the solder joint formation. Lower levels may result in a visibly sluggish or gritty solder. Aluminium is neither soluble in Tin or Lead.

    Element : Aluminium

    Contamination Affects

    This element has the effect of slowing down the transformation of tin into its grey state, sometimes known as ‘tin pest’.

    Element : Arsenic

    Contamination Affects

    In levels of 0.03% this impurity can cause dewetting, but arsenic is not generally a contaminant in lectronic soldering applications.

    Element : Bismuth

    Contamination Affects

    At levels 0.5% and greater there may well be observation of some discoloration and oxidisation of the solder in the solder pot. Very rarely will high amounts of this element, be present in high quality electronic grade alloys today. Bismuth can be added to dull solder but in most cases will simply increase oxidisation of the pot metal.

    Element : Cadmium

    Contamination Affects

    At 0.002% solder joint formation will be visibly affected. At levels of 0.005% and above there will be a high incidence of bridging and icicling, together with a deterioration in overall joint strength and a lack of spread. Cadmium todays is no longer added to solders due to its significant health risks.

    Element : Copper

    Contamination Affects

    At levels of 0.25% copper and sometimes at lower levels the solder joint will have deteriorated and will lead to general dewetting and visible grittiness.

    Element : Gold

    Contamination Affects

    At levels of 0.1% and quite often even less, the solder becomes sluggish and dull joints are formed. Embrittlement may be a problem in smaller dipping pots.

    Element : Iron

    Contamination Affects

    0.02% of iron again can make the solder joint appear gritty.

    Element : Sulphur

    Contamination Affects

    As little as 0.001% will inhibit wetting and produce a grittiness appearance.

    Element : Silver

    Contamination Affects

    Has little effect if any on the overall wetting properties of tin/lead solders although it can be added to suit certain applications.to lower temperatures or increase general joint hardness.

    Element : Zinc

    Contamination Affects

    The presence of Zinc can cause dulling and increase bridging and icicling. 0.005% can cause lack of adhesion and grittiness.

    Accumulation Levels.

    When Copper and Gold in combination add up to 0.25%, then the joint formation will usually have significantly deteriorated. The effects of aluminium, cadmium and zinc are cumulative. If more than one element is present the following lower limits are suggested 0.0005%, 0.002% and 0.001%

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